TAIKO, developed by DISCO Corporation, is a wafer back grinding process that uses a new grinding method. It is used for reducing the risk of the thin wafer handling and lowering the warpage. The grinding process in TAIKO leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. It is one of the essential thinning processes ...
The DUS1010 ultrasonic-wave charging unit charges abrasive grains into a lapping plate. The operating charging block, using ultrasonic-waves, makes it possible to charge small-diameter abrasive grains efficiently in a short time, which was previously impossible by the conventional weight system.
DISCO Corporation is recognized for their significant contributions providing Intel with cutting, grinding and polishing equipment and services, deemed essential to Intel's success. "DISCO is honored to receive this PQS award," stated Hitoshi Mizorogi, DISCO Corporation chairman and CEO.
Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website provides overall corporate information of DISCO such as the variety of products and technical information on the semiconductor manufacturing equipment…
disco corporation equipment for qrindinq of - … DISCO Corporation. Manufacturer of precision dicing saws and grinding wheels providing dicing, grinding, and polishing equipment and services for semiconductor and electronic components.
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines. The Company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.
Photo 1 shows a φ300 mm silicon wafer reduced to 5 µm thickness by grinding only. By optimizing the equipment, wheels, and grinding conditions introduced here, such thinness can be achieved using normal grinding only.
After that, the wafer is thinned to 450 μm using back -side grinding machine , DGP8761HC from DISCO Corporation, Japan and then the through-substrate slots are exposed to the back-side of the wafer (figure 3(l)).
Best Equipment for advanced Dicing-Grinding Service DISCO's high-quality precision technology guarantees excellent processing results. Manufactured at the Kuwabata Plant in Hiroshima Prefecture, DISCO's precision dicing saws and grinding/polishing machines, combined with etchers, surface planers and AOI tools, offer customers the highest level of quality.
servicing disco grinding equipment - marketingpower.in. Product Information | Grinder and Polisher - DISCO Corporation- servicing disco grinding equipment,DAG810 Max Workpiece size mm ø200 Spindle Number of …
Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy. Processing for applications which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system*.
Used Wafer Grinders. EquipNet is the world's leading provider of used wafer grinders and various other pre-owned equipment. Our exclusive contracts with our clients yield a wide range of used wafer grinders from a number of respected OEMs, including Disco Corporation and many others.
DISCO Corporation provides equipment and process solutions to the semiconductor and electronics industries, utilizing our core technologies of Kiru (cutting), Kezuru (grinding), and Migaku (polishing).